Reliability Senior Engineer

Job Objective

To provide detailed test plans and test reports, development of new reliability tests procedure, specifications and statistical data analysis, to provide risk assessments of a design, determine possible failure modes, provide design recommendations to improve product reliability, when necessary, interact with different teams to communicate results and recommendations.

Job Description

• Execute product-level qualification and reliability testing programs in compliance with applicable industry standards, company internal and external customer specifications, and requirements.
  
• Execute reliability evaluation and/or qualification plan, which will include conducting reliability tests, analyze reliability data, presenting data, and writing up technical reports.
  
• Participate in Design of Experiments, troubleshooting, and drive for solution for reliability test failures.
  
• Interface with Design, Test, Fab, Assembly/Packaging, assembly vendors, customers.
  
• Conduct special reliability study to obtain new technology reliability information. Develop short-term and long-term roadmaps for continuous improvement in component selection, design and analysis capability to ensure products have industry-leading Mean Time Before Failure (MTBF).
  
• Perform simulations and design analysis throughout the Development Life Cycle including FEA, Thermal and Vibration.
  
• Drive the integration of reliability principles throughout the Development Life Cycle.
  
• Conduct reliability investigations to identify deficiencies in existing mission and support system and/or to optimize asset reliability, availability, maintainability and safety.
  
• Understand and, where necessary, develop and maintain reliability engineering processes and procedures.
  
• Perform a variety of modelling and analysis that relates to the reliability, availability, maintainability and safety of systems. This includes Failure Mode, Effects and Criticality Analysis (FMECA), Root Cause Analysis (RCA) and Reliability Centre Maintenance (RCM).
  
• Experience performing board level reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing, Environmental Testing, etc.
  
• Provide technical support on Failure Analysis analytical techniques (e.G. Optical Microscopy, X-Ray, CSAM, SEM/EDS, FTIR, XPS etc.).
  
• Ability to use fundamental failure analysis methodology to derive a root cause of failure.
  
• Knowledge of failure modes and statistical life data analysis using curve fitting and distributions models.
  
• Knowledge of industry test Standards (JEDEC, ASTM, IEEE).
  
• Application of DOE (Design of Experiments).
  
• Application of FMEA (Failure Modes and Effects Analysis).
  
• Development of DFQR and DFT methodologies and BKMs.
  
• Leading DFQR and DFT activities during the product design stage.
  
• Product quality &
  reliability validation (QRV) and ongoing quality &
  reliability monitoring (OQRM).
  
• Test program development for the PCBA card reliability test and the test log review
  
• Working with other teams and manufacturing vendors to identify and close the quality and reliability gaps.
  
• Lead and/or support groups of technicians and engineers
  
• Provide guidance to other team members
  
• Train both team and broader organisation members
  

Job requirements

• Bachelor’s or master’s degree in engineering or equivalent
  
• At least 5 years reliability engineering experience
  
• Experience in failure analysis
  
• Understanding of semiconductor physics.
  
• Strong knowledge of statistical models and data analysis.
  
• Strong ability to communicate with a wide variety of internal and external stakeholders.
  
• Ability to multi-task, prioritize numerous competing demands, and problem solve decisively.
  
• Ability to critically think and react to a dynamic environment.
  
• Strong engineering fundamentals and ability to apply knowledge to drive reliability testing.
  
• Sound mathematics and statistical background.
  
• Strong understanding of mechanical, electrical and thermal failure modes in semiconductor material.
  
• Strong data analysis skills (e.G. JMP, MATLab, Python, etc.) and very clear communication skills.